[time-nuts] PCB design questions thread II

[Matthew Smith]

Quoth Bruce Griffiths at 2008-06-03 09:50...

> How do you cope with SMT parts (eg high frequency ADCs) with metal 
> thermal transfer /ground connections under the package itself?

Haven't done it myself, but interested to hear others experiences.  I'm 
guessing that this would be a job for solder paste and a toaster oven - 
or high-tech equivalent.


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Matthew Smith
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