[time-nuts] Power supply for 'Bay FE-5680A?

[David]

On Fri, 06 Jan 2012 17:47:47 +0100, mike cook <michael.cook at sfr.fr>
wrote:

>Le 06/01/2012 17:02, Chuck Forsberg WA7KGX N2469R a écrit :
>> The Tech Manual does not call for heat sinking (unless I missed 
>> something).
>> The top has labels over much of the surface.
>> The bottom has a plastic sheet between the circuitry and bottom plate.
>Yes, I am inclined to agree as I suspect these devices were designed to 
>run in uncontrolled temperature environments.
>
>Maybe the test would be to measure the current draw over temperature, 
>when the box thinks it is warm enough it will stop heating the cell and 
>xo and so that is where it was designed to sit. I will also save you $$s 
>in electricity. Downside could be that hotter parts degrade faster.

What about placing thermal insulation around the oven or even the
entire unit if the heat leakage is kept greater than the total
dissipation?

I have occasionally used a Dixie cup for thermal isolation but the
only place I have used active thermal control is logarithm and
exponential amplifiers.